BIGTREETECHSKR® MINI E3 V3.0 Ender3 VORON V0 Motherboard with TFT35 E3 Screen for 3D Printer Accessories COD

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Introduction:





1. New ID design upgrade

2. Heat sink design upgrade, increase the heat dissipation area, greatly improve the heat dissipation performance

3. Increase the fan that can control the heat dissipation of the device to lower the temperature of the device

4. Increase the thermistor interface protection circuit to prevent burning of the master control chip